| No |
Items |
Content |
Special |
| 1 |
Number of Layer |
1-14 Layer |
Over 5 Layer |
| 2 |
Multiple Printed Panel(Max) |
250*500mm |
|
| 3 |
Finished Board Size (Min) |
5*5mm |
|
| 4 |
Board Thickness (Max) |
0.6mm |
|
| 5 |
Board Thickness (Min) |
0.085mm |
0.065mm |
| 6 |
Finished Board thickness Tolerance
(0.085mm Thickness
< 0.35mm) |
 1.2mil
(0.03mm) |
|
| 7 |
Finished Board thickness Tolerance
(0.035mmThickness
< 0.6mm) |
2mil
(0.05mm) |
|
| 8 |
Hole Size (Max) |
6.5mm |
|
| 9 |
Hole Size(Min) |
0.25mm |
0.20mm |
| 10 |
Board Milling Precision |
0.2mm |
0.15mm |
| 11 |
Finished Board Hole Size(Min) |
0.2mm |
0.15mm |
| 12 |
Copper Foil Thickness (Min) |
1/3OZ |
|
| 13 |
Copper Foil Thickness(Max) |
1OZ |
|
| 14 |
Insolutive Coverage Thickness (Min) |
1mil (PI Thickness:0.5mil. Film
Thickness: 0.5mil) |
|
| 15 |
Insolutive Coverage Thickness (Max) |
2.4mil (PI Thickness: 1mil. Film
Thickness:1.4mil) |
|
| 16 |
Hole Size Tolerance (PTH) |
0.05mm |
|
| 17 |
Hole Size Tolerance (Non PTH) |
0.05mm |
|
| 18 |
Hole Size Tolerance (Compared with
CAD Data ) |
0.05mm |
|
| 19 |
PTH Hole Wall Copper Thickness |
8-15um |
|
| 20 |
Designed Conductor Width/Spacing(Min) |
Double-sided and multilayer Board
4mil/4mil (0.1016mm/0.1016mm)
Single-sided 3/3mil (0.075mm/0.075mm) |
Double-sided and multilayer
Board 3/3mil |
| 21 |
Etching Tolerance |
20%
(Normal) |
10% |
| 22 |
Copper-to-Board Precision (Min) |
0.10mm |
0.07mm |
| 23 |
Paraposition Tolerance of
Silk Screen Mark |
0.25mm |
0.2mm |
| 24 |
Paraposition Tolerance of Solder-resistance
Ink Printing |
Sensitization Type:3mil(0.075mm)
Printing Hot Airing Type: 7.87mil
(0.025mm) |
|
| 25 |
Solder-resistance Thickness |
Sensitization Type: 0.6-1mil(0.015-
0.025mm) Printing Hot Airing: 0.4-0.8mil(0.01-0.02mm) |
|
| 26 |
Paraposition Precision of Coverage
Film(Lamination Offset Tolerance) |
0.3mm |
0.2mm |
| 27 |
Extravasation of Coverage Film Lamination
(Min) |
6mil |
|
| 28 |
Lead/Tin Thickness(Max),(Min) and
Thickness Tolerance |
(2.0mil)/(0.2mil) 3mil |
|
| 29 |
Pure Tin Thickness (Max),(Min) and
thickness Tolerance |
(2.0mil)/(0.2mil) 3mil |
|
| 30 |
Golden Finger Nickel Plating Thickness
(Golden Finger and Other Important Parts) |
30-150u inch |
30-200u inch |
| 31 |
Golden Finger Gold Plating Thickness
(Golden Finger and Other Important Parts) |
1-6u inch |
1-10u inch |
| 32 |
Gold-Nickel/Gold Electrolytic Depositing
(Golden Finger and Other Important Parts) |
Nickel: 30-150u inch
Gold: 21u
inch |
|
| 33 |
Lead/Tin Thickness(Hot Air Leveling) |
0.3-1.0mil |
|
| 34 |
Rust Resistance Treatment |
|
|
| 35 |
Steel Tool Hole Size(Min) Hole Size
Tolerance(Min) |
0.5mm/0.05mm |
0.06/-0mm |
| 36 |
Paraposition Tolerance of Handwork
Lamination |
3mm |
0.2 |
| 37 |
Paraposition Tolerance of Tooling
Lamination |
0.15mm |
|
| 38 |
Tolerance of Out-shape Punching
(Edge to Edge)(Steel Tool) |
0.1mm |
0.05mm |
| 39 |
Tolerance of Out-shape Punching
(Hole to Edge)(Steel Tool) |
0.1mm |
0.07mm |
| 40 |
Tolerance of Out-shape Punching
(Edge to Edge)(Cutting Tool) |
0.30mm |
|
| 41 |
Tolerance of Out-shape Punching
(Edge to Edge)(Simple Tool) |
0.15mm |
|
| 42 |
Size Tolerance of Finger Center
to Board Edge |
0.10mm |
0.07mm |
| 43 |
Tolerance of Neighbouring Finger
Center Space |
0.03mm |
|
| 44 |
Tolerance of Finished Board Impedance
(Min) |
10% |
|
| Other |
Item |
Contents |
Note |
| 1 |
On-off Test Voltage |
25025V |
|
| 2 |
Short Circuit Resistance |
 10M |
|
| 3 |
Circuit Breaking Resistance |
100 |
|
| 4 |
Tin Solderability Test |
2455C°,Time5Sec |
|
| 5 |
Thermal Stress Test |
2885C°,Time5Sec |
|
| 6 |
Thermal Resistance |
94V-0 |
|
