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Application: Digital
Camera
FPC Type: 2-layer FPC
Technology Parameter:
1mil PI, 1OZ Rolled Copper,
Thickness0.15-0.18mm, Tin plating without Lead
4-6UM, Conductor width 0.2mm, conductor pitch
0.2mm, Min hole size 0.2mm
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Application: Digital Camera
FPC Type: 2-layer FPC
Technology Parameter:
1mil PI, 1OZ Rolled Copper,
Thickness0.15-0.18mm, Tin plating without Lead 4-6UM,
Conductor width 0.2mm, conductor pitch 0.2mm, Min
hole size 0.3mm |
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MP3 Application: MP3
FPC Type: 2-layer FPC
Technology Parameter:
1mil PI, 1OZ Rolled Copper,
Thickness0.15-0.18mm, Tin plating without Lead 4-6UM,
Conductor width 0.2mm, conductor pitch 0.2mm, Min
hole size 0.3mm
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Application: Mobile Phone
FPC Type: 3-layer FPC
Technology Parameter:
1/2mil PI 1/2OZ Rolled Copper
0.2mm FR-4 Stiffener thickness 0.4-0.45mm, Gold
plating 0.03-0.05UM, Conductor width 0.2mm, conductor
pitch 0.1mm, Min hole size 0.2mm
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MP3 Application: MP3
FPC Type: 2-layer FPC
Technology Parameter:
1mil PI, 1OZ Rolled Copper,
Total thickness 0.15-0.18mm, Tin plating 4-6UM.
Conductor width 0.15mm, conductor pitch 0.15mm.
Min hole size 0.3mm |
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ELSE Application: Else
FPC Type: 2-layer FPC
Technology Parameter:
1mil PI, 1OZ Rolled Copper,
Tin plating thickness 0.15-0.18mm, Tin plating thickness
4-6UM. Conductor width 0.2mm, conductor pitch 0.2mm.
Min hole size 0.3mm
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ELSE Application: Else
FPC Type: 2-layer FPC
Technology Parameter:
1mil PI, 1OZ Rolled Copper,
Tin plating thickness 0.15-0.18mm, Tin plating thickness
0.03-0.04 UM , Conductor width0.2mm, Conductor pitch0.2mm,Min
hole size 0.2mm
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ELSE Application: Else
FPC Type: 2-layer FPC
Technology Parameter:
1mil PI, 1OZ Rolled Copper,
OSP thicknes0.15-0.18mm,Tin plating thickness0.03-0.04UM
, Conductor width 0.25mm , Conductor pitch0.2mm,
Min hole size 0.3mm
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